Hybrid Glide-Symmetric Unit Cell for Leakage Reduction in Millimeter-Wave PCB Interconnections to Waveguide Components

Gonzalez-Gallardo, David; Algaba-Brazalez, Astrid; Manholm, Lars; Johansson, Martin; Quevedo-Teruel, Oscar

doi:10.1109/TMTT.2022.3152731

Hybrid Glide-Symmetric Unit Cell for Leakage Reduction in Millimeter-Wave PCB Interconnections to Waveguide Components

Gonzalez-Gallardo, David ¹
Algaba-Brazalez, Astrid ¹
Manholm, Lars ¹
Johansson, Martin ¹
Quevedo-Teruel, Oscar ²

1 Ericsson AB, Gothenburg, Sweden
2 Division of Electromagnetic Engineering, KTH Royal Institute of Technology, Stockholm, Sweden

Revista:

IEEE Transactions on Microwave Theory and Techniques

ISSN: 0018-9480, 1557-9670

Año de publicación: 2022

Volumen: 70

Número: 5

Páginas: 2631-2641

Tipo: Artículo

DOI: 10.1109/TMTT.2022.3152731 GOOGLE SCHOLAR Acceso abierto editor

Otras publicaciones en: IEEE Transactions on Microwave Theory and Techniques

Resumen

In this article, we propose a hybrid glide-symmetric metasurface which presents an electromagnetic bandgap (EBG) behavior at the Ka -band. The innovative part of this work is the hybrid nature of the periodic structure, which is implemented with holes on two different technologies: printed circuit board (PCB) and metallic waveguide. These holes avoid propagation in an undesired parallel plate created between a PCB and a metallic waveguide. To demonstrate the potential of this concept, a hybrid glide-symmetric configuration was placed surrounding a PCB–waveguide transition at the Ka -band to reduce the leakage created by undesired air gaps. A prototype was manufactured and measured to corroborate the effectiveness of this technique to reduce losses and crosstalk.

€ Ver financiación

Información de financiación

Financiadores

Strategic Innovation Program Smarter Electronics System—a joint venture of Vinnova, Formas, and the Swedish Energy Agency, through the Project High-5
- 2018-01522

Referencias bibliográficas

10.1063/5.0041586
10.1109/LAWP.2021.3060283
10.1109/JMW.2020.3033847
10.1109/PROC.1973.9003
10.1109/TAP.1970.1139607
10.1109/PROC.1964.2740
10.1109/TMTT.2020.3023751
10.1109/MWSYM.2005.1517163
10.1109/LMWC.2013.2281408
10.1109/TAP.2020.2998865
10.1049/el.2012.2901
10.23919/EuCAP48036.2020.9135320
10.1109/EuCAP.2012.6206199
10.1109/JMEMS.2015.2500277
10.1049/el.2016.3536
10.1109/LMWC.2017.2661881
10.1109/LMWC.2018.2865506
10.1109/LMWC.2018.2824563
10.1109/ACCESS.2020.3012596
10.1109/IMS30576.2020.9224023
10.1109/7260.1000191
10.1109/TMTT.2020.3021087
(2021), Technical Specification TS38 104 Release 17 (version 17 2 0)
10.1109/TAP.2019.2944535
(2020), Ericsson Microwave Outlook
10.2528/PIERL16040801
10.1109/TAP.2020.3008620
10.5772/54662
mizuno, (2016), Proc Int Symp Antennas Propag (ISAP), pp. 374
lischka, (2005)
wikström, (2020), Ever-present intelligent communication
10.1109/TMTT.2018.2884885
osseiran, (2020), 5G wireless access An overview
10.1109/LMWC.2017.2701308
10.1109/LMWC.2018.2832013
10.1109/TMTT.2017.2764091
(2019), A metasurface arrangement
10.1109/LMWC.2019.2906460
gonzález-gallardo, (2019)
10.1109/TAP.2019.2922829
10.1109/TAP.2019.2943437
10.1109/LMWC.2019.2953211