Effects of thermophoresis particle deposition and of the thermal conductivity in a porous plate with dissipative heat and mass transfer

  1. Zueco, J. 3
  2. Anwar Bég, O. 1
  3. López-Ochoa, L.M. 2
  1. 1 Sheffield Hallam University
    info

    Sheffield Hallam University

    Sheffield, Reino Unido

    ROR https://ror.org/019wt1929

  2. 2 Universidad de La Rioja
    info

    Universidad de La Rioja

    Logroño, España

    ROR https://ror.org/0553yr311

  3. 3 Universidad Politécnica de Cartagena
    info

    Universidad Politécnica de Cartagena

    Cartagena, España

    ROR https://ror.org/02k5kx966

Journal:
Acta Mechanica Sinica

ISSN: 0567-7718

Year of publication: 2011

Volume: 27

Issue: 3

Pages: 389-398

Type: Article

DOI: 10.1007/S10409-011-0461-9 SCOPUS: 2-s2.0-80052492734 WoS: WOS:000292036800010 GOOGLE SCHOLAR

More publications in: Acta Mechanica Sinica

Abstract

Network simulation method (NSM) is used to solve the laminar heat and mass transfer of an electricallyconducting, heat generating/absorbing fluid past a perforated horizontal surface in the presence of viscous and Joule heating problem. The governing partial differential equations are non-dimensionalized and transformed into a system of nonlinear ordinary differential similarity equations, in a single independent variable, h. The resulting coupled, nonlinear equations are solved under appropriate transformed boundary conditions. Computations are performed for a wide range of the governing flow parameters, viz Prandtl number, thermophoretic coefficient (a function of Knudsen number), thermal conductivity parameter, wall transpiration parameter and Schmidt number. The numerical details are discussed with relevant applications. The present problem finds applications in optical fiber fabrication, aerosol filter precipitators, particle deposition on hydronautical blades, semiconductor wafer design, thermo-electronics and problems including nuclear reactor safety. © The Chinese Society of Theoretical and Applied Mechanics and Springer-Verlag Berlin Heidelberg 2011.