Mathematical Modeling of SOIC Package Dynamics in Dielectric Fluids during High-Voltage Insulation Testing
- Aparicio, Y.A.
- Jimenez, M.
Aldizkaria:
Applied Sciences (Switzerland)
ISSN: 2076-3417
Argitalpen urtea: 2024
Alea: 14
Zenbakia: 9
Mota: Artikulua
