Mathematical Modeling of SOIC Package Dynamics in Dielectric Fluids during High-Voltage Insulation Testing

  1. Aparicio, Y.A.
  2. Jimenez, M.
Revue:
Applied Sciences (Switzerland)

ISSN: 2076-3417

Année de publication: 2024

Volumen: 14

Número: 9

Type: Article

DOI: 10.3390/APP14093693 GOOGLE SCHOLAR lock_openAccès ouvert editor

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